X-Wave Converting Open House 2026
Die-cutting at the speed of light
18-19 NOVEMBER 2026, from 9:00 AM to 4:00 PM · SEI S.P.A. · VIA SAN CASSIANO, 2 – 24030 MAPELLO (BG) ITALY
TWO DAYS DEDICATED TO DIGITAL LASER DIE-CUTTING FOR CORRUGATED BOARD
During the Open House, you will have the opportunity to see the X-Wave Converting laser system in action through live demonstrations and real-world applications. Discover how digital die-cutting can overcome the constraints of conventional cutting dies, reduce setup times and increase flexibility, productivity and design freedom in corrugated cardboard converting.
During the event, you will have the opportunity to:
- Attend live demonstrations of cutting and digital die-cutting across a range of corrugated board applications;
- Explore the capabilities of the X-Wave Converting system and discover how it can reduce production times, costs and complexity;
- Consult with our technical experts to evaluate materials, applications, workflows and new opportunities offered by digital laser die-cutting;
- Discover how to easily integrate SEI Laser solutions into your existing production lines, improving precision, productivity and flexibility without changing your current workflow.
Don’t miss the opportunity to experience the full potential of SEI Laser technology firsthand!
