The compact laser machine for cutting and marking.

  • Processes: cutting, kiss-cutting and marking
  • Processable materials: paper, card, leather, faux leather, hide, natural and technical textiles, rubber, wood, plastic, etc.
  • Sectors: small items and furnishing accessories (customisation), decoration and marquetry, stamps, display cases, footwear and leather
  • High flexibility of use
  • High quality and accurate cutting
  • High productivity
  • High performance: up to 2000 mm/s speed and 2 G acceleration.
  • CCD camera and kit for register cutting with print marker recognition
  • Possibility of processing sheet materials of sizes that are greater than the work area (Y axis)
  • Work area: up to 700×500 mm (B2 FORMAT)
  • ICARO proprietary software
  • Industry 4.0 Ready: full digital workflow integration


  • CCD optics
  • Double cutting head

fairs and events

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We are happy to inform you that from 22 to 24 of October 2020 we will be at VISCOM ITALIA fair in Milan (Italy).…


We are happy to inform you that from 10 to 12 of October 2019 we will be at VISCOM ITALIA fair in Milano (Italy). Hall…


news and press

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FESPA FAIR – SEI Laser will be present at the next Fespa 2017, taking place in Hamburg from 8th to 12th…



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