The smallest laser machine for cutting, kiss-cutting and marking

  • Processes: cutting, kiss-cutting and marking
  • Processable materials: paper, card, leather, faux leather, hide, natural and technical textiles, rubber, wood, plastic (not PVC), etc.
  • Sectors: graphic arts, wood engraving, job shops
  • Compact laser, easy to install in any work environment
  • High quality marking
  • High level of accuracy and high cutting speed of thin materials
  • Large front opening to assist loading/unloading operations
  • Easy access to the work area thanks to 3 open sides
  • Motorised Z axis that helps to optimise the dimensions of the laser spot depending on the size and thickness of the material
  • Work area: from 160×160 to 300X300 mm
  • A smaller area is available for more accurate, precise marking
    ICARO proprietary software
  • Industry 4.0 Ready: full digital workflow integration


  • Single rotary attachment

fairs and events

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We are happy to inform you that from February 4th to 6th 2020 we will be at C!PRINT fair in Lyon (France). STAND 2T20 Visit…


We are happy to inform you that from FEBRUARY 5 to 7 2019 we will be at C!PRINT fair in Lyon (France). Visit…


news and press

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SEI Laser, in partnership with Dyloan Studio, will be present at Lineapelle – A new point of view, Fieramilano Rho, on…


FESPA FAIR – SEI Laser will be present at the next Fespa 2017, taking place in Hamburg from 8th to 12th…



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