Eureka

Eureka

High flexibility in a compact laser machine for cutting and marking.


Eureka
  • Processes: cutting, kiss-cutting and marking
  • Processable materials: paper, card, leather, faux leather, hide, natural and technical textiles, rubber, wood, plastic, glass, marble, etc.
  • Sectors: small items and furnishing accessories (customisation), decoration and marquetry, stamps, display cases, footwear, leather goods,… processing of materials in sheets and rolls
  • Flexibility of use
  • High quality and accurate cutting
  • High productivity
  • High performance: up to 2000 mm/s speed and 2 G acceleration.
  • CCD camera and kit for register cutting with print marker recognition
  • Possibility of processing sheet materials of sizes that are greater than the work area (Y axis)
  • 3D kit for cutting/cutting out and cutting of materials with surface with 3D rotation
  • 360° rotary axis unit for engraving and/or cutting on cylindrical items
  • Work surface with motorised Z axis up to 250 mm
  • Second cutting head kit for simultaneous processing
  • Easy integration with external automation (I/O interface and Winsock)
  • Work area: up to 610×460 mm
  • ICARO proprietary software
  • Industry 4.0 Ready: full digital workflow integration

Options:

  • Conveyor for processing materials on rolls
  • Single or double rotary attachment

fairs and events

see all
12.11.2020

We are pleased to inform you that from November 17th to 18th 2020 we will take part to Viscom Italia…

continue
28.01.2019

We are happy to inform you that from 10 to 12 of October 2019 we will be at VISCOM ITALIA fair in Milano (Italy). Hall…

continue

news and press

see all
12.11.2020

On 17 and 18 November 2020, we will be present at the virtual event Viscom Italia Hyper Reality 2020 with our…

continue
20.04.2017

FESPA FAIR – SEI Laser will be present at the next Fespa 2017, taking place in Hamburg from 8th to 12th…

continue

contacts

Do you need more information about this product?
Write to us and we will contact you as soon as possible

* I accept the terms of the privacy policy

All fields marked with an asterisk (*) are required